The Principal EE holds a pivotal role within a dynamic, interdisciplinary team operating in an innovative startup environment, tasked with crafting cutting-edge Lidar solutions for automotive, industrial, and consumer sectors. You will define system-level requirements and functionalities, subsequently translating them into hardware design. Your responsibilities encompass analog, mixed-signal, and high-speed digital circuit design and simulation, schematic creation, PCB layout, component selection, prototype assembly, design validation, and documentation.

Responsibilities:

• Oversee all facets of electrical design to ensure product features, system performance, and quality for cost-effective, high-volume 3D sensing applications.
• Autonomously develop transmitter, receiver, and compute boards to deliver distinctive products leveraging core technologies.
• Lead the assessment and selection of electrical components and subsystems.
• Manage the electrical testing and prototyping process, including infrastructure and equipment.
• Plan, execute, and report on design validation, electrical performance, and compliance with industry standards.
• Supervise board assembly and initiation, liaising with both domestic and international contractors and suppliers.
• Collaborate closely with FPGA, mechanical, optical, and system engineers, alongside other cross-functional team members, to achieve technology, performance, and schedule objectives in meeting product features and requirements.
• Work in tandem with cross-functional teams to define requirements and formulate project plans.

Qualifications:

• Bachelor’s degree in Electrical Engineering, with preference for an advanced degree.
• Minimum of 10 years of industry experience or 7 years with an advanced degree.
• Proficiency in analog, mixed-signal, and high-speed digital circuit design.
• Demonstrated expertise in designing multi-layer, high-density, and complex PCBs.
• Familiarity with DFX and best practices for power integrity and signal integrity.
• Proficiency with schematic capture and PCB layout design tools, with a preference for Altium Designer.
• Experience with high-speed differential data interfaces (e.g., MIPI CSI 2, LVDS, USB, Ethernet) and serial peripheral interfaces (e.g., SPI, I2C, UART).
• Desirable experience in 3D sensing-related technologies such as LiDAR and Radar.

Package: 

• Comprehensive health insurance coverage.
• Dental and vision benefits.
• Flexible Spending Account (FSA) and Health Savings Account (HSA) options.
• Paid Time Off (PTO) allocation.
• 14 Paid Holidays annually.
• Company-paid benefits including Life Insurance, Long Term Disability, and Short Term Disability.